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| 1. general description the pca82c250 is the interfac e between a can protocol controller and the physical bus. the device provides di fferential transmit capability to the bus and differential receive capability to the can controller. 2. features and benefits ? fully compatible with the ?iso 11898? standard ? high speed (up to 1 mbd) ? bus lines protected against transients in an automotive environment ? slope control to reduce radio frequency interference (rfi) ? differential receiver with wide common-mode range for high immunity against electromagnetic interference (emi) ? thermally protected ? short-circuit proof to battery and ground ? low-current standby mode ? an unpowered node does not disturb the bus lines ? at least 110 nodes can be connected 3. applications ? high-speed automotive applications (up to 1 mbd). 4. quick reference data pca82c250 can controller interface rev. 06 ? 25 august 2011 product data sheet table 1. quick reference data symbol parameter conditions min max unit v cc supply voltage 4.5 5.5 v i cc supply current standby mode - 170 ? a 1/t bit maximum transmission speed non-return-to-zero 1 - mbd v can canh, canl input/output voltage ? 8+18v v diff differential bus voltage 1.5 3.0 v t pd propagation delay high-speed mode - 50 ns t amb ambient temperature ? 40 +125 ?c
pca89c250 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 06 ? 25 august 2011 2 of 18 nxp semiconductors pca82c250 can controller interface 5. ordering information 6. block diagram 7. pinning information 7.1 pinning table 2. ordering information type number package name description version pca82c250t so8 plastic small outline pack age; 8 leads; body width 3.9 mm sot96-1 fig 1. block diagram mka669 receiver hs reference voltage slope/ standby protection driver 3 2 5 4 8 1 6 7 gnd canl canh v ref txd rs rxd v cc pca82c250 fig 2. pin configuration 1 2 3 4 8 7 6 5 mka670 pca82c250 rs canh gnd canl v ref rxd v cc txd pca89c250 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 06 ? 25 august 2011 3 of 18 nxp semiconductors pca82c250 can controller interface 7.2 pin description 8. functional description the pca82c250 is the interfac e between a can protocol controller and the physical bus. it is primarily intended for high-speed automot ive applications (up to 1 mbd). the device provides differential transmit capability to the bus and differential receive capability to the can controller. it is fully compatible with the ?iso 11898? standard. a current limiting circuit protects the transmitter output stage against short-circuit to positive and negative battery voltage. although the power dissipation is increased during this fault condition, this feature will prevent destruction of the transmitter output stage. if the junction temperature exceeds a value of approximately 160 ? c, the limiting current of both transmitter outputs is decreased. because the transmitter is responsible for the major part of the power dissipation, this will result in reduced powe r dissipation and hence a lower chip temperature. all other parts of the pca82c250 will remain in operation. the thermal protection is needed, in partic ular, when a bus line is short-circuited. the canh and canl lines are also protected against electrical transients which may occur in an automotive environment. pin 8 (rs) allows three different modes of operation to be selected: high-speed, slope control and standby. for high-speed operation, the transmitter output transistors are simply switched on and off as fast as possible. in this mode, no measures are taken to limit the rise and fall slope. use of a shielded cable is recommended to avoid rfi problems. the high-speed mode is selected by connecting pin 8 to ground. for lower speeds or shorter bus length, an un shielded twisted pair or a parallel pair of wires can be used for the bus. to reduce rfi, the rise and fall slope should be limited. the rise and fall slope can be programmed with a resistor connected from pin 8 to ground. the slope is proportional to the current output at pin 8. if a high level is applied to pin 8, the circuit enters a low-current standby mode. in this mode, the transmitter is switched off and the receiver is switched to a low current. if dominant bits are detected (differential bus voltage >0.9 v), rxd will be switched to a table 3. pin description symbol pin description txd 1 transmit data input gnd 2 ground v cc 3 supply voltage rxd 4 receive data output v ref 5 reference voltage output canl 6 low-level can voltage input/output canh 7 high-level can voltage input/output rs 8 slope resistor input pca89c250 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 06 ? 25 august 2011 4 of 18 nxp semiconductors pca82c250 can controller interface low level. the microcontroller should react to this condition by switching the transceiver back to normal operation (via pin 8). because the receiver is slow in standby mode, the first message will be lost. [1] x = don?t care. 9. limiting values [1] in accordance with ?iec 60747-1? . an alternative definition of virtual junction temperature is: t vj =t amb +p d ? r th(vj-a) , where r th(j-a) is a fixed value to be used for the calculation of t vj . the rating for t vj limits the allowable combinat ions of power dissipation (p d ) and ambient temperature (t amb ). [2] classification a: human body model; c = 100 pf; r = 1500 ? ; v = ? 2000 v. [3] classification b: machine model; c = 200 pf; r = 25 ? ; v = ? 200 v. table 4. truth table of the can transceiver supply txd canh canl bus state rxd 4.5 v to 5.5 v 0 high low dominant 0 4.5 v to 5.5 v 1 (or floating) floating floating recessive 1 < 2 v (not powered) x [1] floating floating recessive x [1] 2v pca89c250 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 06 ? 25 august 2011 6 of 18 nxp semiconductors pca82c250 can controller interface [1] i 1 =i 4 =i 5 =0ma; 0v pca89c250 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 06 ? 25 august 2011 7 of 18 nxp semiconductors pca82c250 can controller interface fig 3. test circuit for dynamic characteristics. fig 4. timing diagram for dynamic characteristics. fig 5. hysteresis. 015aaa208 30 pf 100 pf 60 100 nf +5 v pca82c250 rxd v ref txd canh canl gnd v cc r ext rs 6 t fftxd t ffrxd t ntxd v rxd v ff v txd t nrxd 03v cc 0 v 05 v 0v cc v cc 0 v 63 steress v rxd hgh lo 05 v 0 v v ff pca89c250 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 06 ? 25 august 2011 8 of 18 nxp semiconductors pca82c250 can controller interface v 1 =1v. fig 6. timing diagram for wake-up from standby. v 1 =4v; v 8 =4v. fig 7. timing diagram for bus dominant to rxd low. the waveforms of the applied transients shall be in accordance with ?iso 7637 part 1? , test pulses 1, 2, 3a and 3b. fig 8. test circuit for automotive transients. mka674 t wake v rs v rxd v cc 0 v mka675 t drxdl 1.5 v 0 v v diff v rxd 015aaa246 pca82c250 rxd v ref txd canh canl gnd v cc schaffner generator 60 +5 v r ext rs 1 nf 1 nf pca89c250 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 06 ? 25 august 2011 9 of 18 nxp semiconductors pca82c250 can controller interface 12. application information fig 9. application of the can transceiver. fig 10. application with galvanic isolation. mka677 p8xc592/p8xce598 can-controller pca82c250t can-transceiver ctx0 crx0 crx1 px,y txd rxd v ref canl can bus line canh rs r ext +5 v 100 nf 124 124 v cc gnd v dd v ss r ext +5 v +5 v +5 v 0 v 100 nf 100 nf 390 390 390 6.8 k 3.6 k 390 6n137 6n137 mka678 pca82c250 can-transceiver txd rxd v ref canl can bus line canh rs +5 v 100 nf 124 124 v cc gnd sja1000 can-controller tx0 tx1 rx0 rx1 pca89c250 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 06 ? 25 august 2011 10 of 18 nxp semiconductors pca82c250 can controller interface fig 11. internal pin configuration. mka679 7 6 2 5 4 8 1 3 txd v cc rs rxd v ref gnd canh canl pca82c250 pca89c250 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 06 ? 25 august 2011 11 of 18 nxp semiconductors pca82c250 can controller interface 13. package outline fig 12. package outline sot96-1 (so8) unit a max. a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz ywv references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 0.25 dimensions (inch dimensions are derived from the original mm dimensions) notes 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. 1.0 0.4 sot96-1 x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 4 5 pin 1 index 1 8 y 076e03 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.20 0.19 0.16 0.15 0.05 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.01 0.041 0.004 0.039 0.016 0 2.5 5 mm scale so8: plastic small outline package; 8 leads; body width 3.9 mm sot96-1 99-12-27 03-02-18 pca89c250 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 06 ? 25 august 2011 12 of 18 nxp semiconductors pca82c250 can controller interface 14. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 ?surface mount reflow soldering description? . 14.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electr ical circuits. the soldered joint provides both the mechanical and the electrical connection. th ere is no single sold ering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for fine pitch smds. reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 14.2 wave and reflow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased pr obability of bridging. the reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. leaded packages, packages with solder balls, and leadless packages are all reflow solderable. key characteristics in both wave and reflow soldering are: ? board specifications, in cluding the board finish , solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivit y level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 14.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhe sive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath specifications, including temperature and impurities pca89c250 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 06 ? 25 august 2011 13 of 18 nxp semiconductors pca82c250 can controller interface 14.4 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 13 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 9 and 10 moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 13 . table 9. snpb eutectic process (from j-std-020c) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 ? 350 < 2.5 235 220 ? 2.5 220 220 table 10. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 pca89c250 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 06 ? 25 august 2011 14 of 18 nxp semiconductors pca82c250 can controller interface for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . msl: moisture sensitivity level fig 13. temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature pca89c250 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 06 ? 25 august 2011 15 of 18 nxp semiconductors pca82c250 can controller interface 15. revision history table 11. revision history document id release date data sheet status change notice supersedes pca82c250_6 20110825 product data sheet - pca82c250_5 modifications: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? dip8 package discontinued; bare die no longer available. ? typing errors corrected in table 8 , figure 3 and figure 8 . pca82c250 v.5 20000113 product specification - pca82c250 v.3 pca82c250 v.3 19971021 preliminary specification pca82c250 v.2 pca82c250 v.2 19940915 - pca82c250 v.1 pca82c250 v.1 19940408 - - pca89c250 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 06 ? 25 august 2011 16 of 18 nxp semiconductors pca82c250 can controller interface 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use in automotive applications ? this nxp semiconductors product has been qua lified for use in automotive applications. the product is not desi gned, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be ex pected to result in personal injury, death or severe property or environmental dam age. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification. pca89c250 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 06 ? 25 august 2011 17 of 18 nxp semiconductors pca82c250 can controller interface export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from national authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com nxp semiconductors pca82c250 can controller interface ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 25 august 2011 document identifier: pca89c250 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 1 5 ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 functional description . . . . . . . . . . . . . . . . . . . 3 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 10 thermal characteristics . . . . . . . . . . . . . . . . . . 5 11 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 12 application information. . . . . . . . . . . . . . . . . . . 9 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 14 soldering of smd packages . . . . . . . . . . . . . . 12 14.1 introduction to soldering . . . . . . . . . . . . . . . . . 12 14.2 wave and reflow soldering . . . . . . . . . . . . . . . 12 14.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 14.4 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 16 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 17 contact information. . . . . . . . . . . . . . . . . . . . . 17 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 |
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